PCB Capability

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PCB   CAPABILITY

Item Mass Producation Small Batch Producation
Layers 1-16 Layers 28 Layers
Material  FR-4,Halogen free,High TG, PTFE,Aluminum  BT,Rogers
Max. board size (mm) 610 *460 635 * 546
Board thickness (mm) 0.3 – 3.5 0.2-6.0
Min. Line width/space (mm) 0.1/0.1 0.076/0.076
Min. Line gap +/-15% +/-10%
Outer Layer copper thickness (OZ) 4 6
Inner layer copper thickness 2 4.5
Min. Finished hole size(Mechanical)-(mm) 0.2 0.15
Min. Finished hole size(laser hole)-(mm) 0.1 0.1
Aspect ratio 01:00.0 0.542361111
Solder Mask color Green, Blue, white, Black, Red, Yellow
Impedance control tolerance <=+/-10%
Surface Treatment
Flas Gold  (um) 0.025-0.075 0.025-0.5
ENIG   (um) 0.05-0.1 0.1-0.2
HASL  (um) 1-70
LF HASL  (um) 1-70
OSP(Entek)  (um) 0.08-0.3
Gold Finger  (um) 0.375< X < 1.75 >=1.75
Hard Gold Plating  (um) 0.375< X < 1.75 >=1.75
Immsion Sn  (um) 0.8 < X <=1.2
V-cut  (Degree) 20, 30, 45, 60

Outline Profile

Min. distance between the IC pads can keep sm bridge(MM) 0.25 0.2
Min. SM bridge for green soldermask(MM) 0.1 0.076
Min. SM bridge for black soldermask(MM) 0.125 0.1
Tolerance of dimension size (MM) <=+/-0.13 +/-0.1
Tolerance of board thickness (MM) >=1.0 +/-10% +/- 8%
< 1.0  +/-0.1 +/- 8%
Tolerance of finished NPTH hole size(MM) 0.05 0.05
Tolerance of finished PTH hole size(MM) 0.076 0.05
Delivery Time Mass: 10 -14 Days Samples: 4-6 Days