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Capacity

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Technical Capacity

Printed circuit Board (PCB)

Item

Mass Producation

Small Batch Producation

Layers

1-16 Layers

28 Layers

Material

 FR-4,Halogen free,High TG, PTFE,Aluminum  BT,Rogers

Max. board size (mm)

610 *460

635 * 546

Board thickness (mm)

0.3 - 3.5

0.2-6.0

Min. Line width/space (mm)

0.1/0.1

0.076/0.076

Min. Line gap

+/-15%

+/-10%

Outer Layer copper thickness (OZ)

4

6

Inner layer copper thickness

2

4.5

Min. Finished hole size(Mechanical)-(mm)

0.2

0.15

Min. Finished hole size(laser hole)-(mm)

0.1

0.1

Aspect ratio

10:01

13:01

Solder Mask color

Green, Blue, white, Black, Red, Yellow

Impedance control tolerance

<=+/-10%

 

Surface Treatment

 

 

Flash Gold  (um)

0.025-0.075

0.025-0.5

ENIG   (um)

0.05-0.1

0.1-0.2

HASL  (um)

1-70

 

LF HASL  (um)

1-70

 

OSP(Entek)  (um)

0.08-0.3

 

Gold Finger  (um)

0.375< X < 1.75

>=1.75

Hard Gold Plating  (um)

0.375< X < 1.75

>=1.75

Immsion Sn  (um)

0.8 < X <=1.2

 

V-cut  (Degree)

20, 30, 45, 60

 

Min. distance between the IC pads can keep sm bridge(MM)

0.25

0.2

Min. SM bridge for green soldermask(MM)

0.1

0.076

Min. SM bridge for black soldermask(MM)

0.125

0.1

Tolerance of dimension size (MM)

<=+/-0.13

+/-0.1

Tolerance of board thickness (MM)

>=1.0 +/-10%

+/- 8%

 

< 1.0  +/-0.1

+/- 8%

Tolerance of finished NPTH hole size(MM)

0.05

0.05

Delivery Time

Mass: 10 -14 Days

Samples: 4-6 Days

PCB Assembly (PCBA)

Max PCB Size (MM)

510 * 460

Min PCB Size (MM)

50 * 50

Board Thickness (MM)

0.4 - 5.0

Components size (MM)

0201 -150

Components max heigh (MM)

25

Max BGA Size (MM)

74 * 74

QFP lead pitch (MM)

0.3 - 2.54

BGA ball pitch (MM)

0.4 - 1.0

BGA ball diameter (MM)

0.45 - 0.76

Min chip size

01 005

Placement precision (MM)

+/- 0.03

Laser cut for stencil manufacture for manual,

semi-automatic and full automatic solder print machine, the accuracy can be 5 um.

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